The Dieline Package Design Conference brings together the worldwide network of Dieliners and Package Design aficionados under one roof. From package designers of all levels, to tastemakers, to top industry experts, all connecting at sharing their passion for package design.

This year the Conference will take place June 22–24 in Chicago and will include several vibrant design events. The participants will get plenty of opportunities to connect with other industry people, be it a planned event like Breakfast Roundtables, or informal one like Resource Center visits.

One of the main events is The Dieline Awards Ceremony 2011: 39 winners across 13 different categories will be awarded a prestegious Dieline Award, and one Best of Show winner will be chosen as the grand winner.

For further information please visit http://www.thedieline.com/conference.